CircuiTree, February 1st, 2007
High density interconnects (HDI) among dielectric layers have been widely employed in fabrication of state-of-the-art PCBs in order to meet the requirements of portable and foldable consumer electronic products. Also, advanced IC substrates need HDI in order to meet the high I/O counts of advanced IC chips [1,2]. Currently, microvias, which are commonly formed by laser drilling, are responsible for the interconnection of IC substrate and PCBs. One microvia located in a dielectric layer is able to connect two conducting lines that are individually located up and down the dielectric layer. On ...
HighBeam Research, Free Preview: 'Through hole filling by copper electroplating for SiP: a novel copper electroplating formula is developed that achieves through hole filling while employing DC plating. A possible electrochemical mechanism for TH filling is proposed in this work.'... Full Membership required for unlimited access. Free 7-day trial.
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