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R & D needs for packaging: WLPs may be the answer to the widening gap between device cost and packaging cost.(Packaging Roadmap)

About 1 pages (306 words)

Circuits Assembly, October 1st, 2007

Ed.: For the complete article, visit circuitsassembly.com/cms/content/view/5446.

The packaging industry enjoyed significant growth between 2004 and 2006, based on increased demand for semiconductor and electronic products overall. However, capacity expansion to address this growth has been conservative, resulting in some constraints in supply and higher prices. As a result, many integrated device manufacturers (IDMs) have expanded internal operations during this cycle (in parallel with increasing outsourcing) to balance the cost and risk of capital investments.

There also has been rapid em...

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Adam, Joe. Circuits Assembly, October 1st, 2007. R & D needs for packaging: WLPs may be the answer to the widening gap between device cost and packaging cost.(Packaging Roadmap). Content provided by HighBeam Research.



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