Microwaves & RF, April 1st, 2004
Adhesives replace solder in high-power devices The novel DM6030Hk series of patented, silver-filled organic adhesives feature thermal properties that generally exceed those of traditional solders used in high-power devices. The adhesives exhibit thermal conductivities as high as 60 W/mK and electrical resistivities as low as 6 ยต Wcm for thermal resistance that is equal to or better than Au/Sn solder in many high-power applications. Unlike solder attach, the DM6030Hk pastes require no plating of components, no flux or non-oxidizing atmosphere, have minimal voiding in the bondline, and is Pb-f...
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